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DSM to show latest material applications at NPE

07 Jan '15
3 min read

Global Life Sciences and Materials Sciences company, Royal DSM will showcase latest applications made from its materials at NPE being held in Orlando, Florida from March 23-27, 2015.

DSM will highlight several of these solutions via speaker presentations at SPI and ANTEC as well as in their Customer Service Center in the West Hall, Room 225A.

On display will be thermoplastic composite gas tanks for Compressed Natural Gas (CNG) that the company is developing with a partner, a specialist in advanced thermoplastic composite vessels.

“Together with hydrogen, natural gas is claiming its place in the field of cost-effective and low carbon footprint fuels for use in automobiles,” DSM says.

Tim Vorage, global incubator manager at DSM Engineering Plastics, will be presenting on ‘Thermoplastic Composite Pressure Vessels’ on March 25 during the SPI Business of Plastics Seminars.

The presentation, which will take place at 9:30 in the West Building Level 4, Room W414D, will present a novel concept for the production of Type V compressed natural gas (CNG) tanks.

DSM says its leadership in polyamide 6 (Akulon) and thermoplastic copolyester for thin film (Arnitel) for flexible food packaging is helping customers to provide better solutions to rapidly changing food packaging needs.

DSM recently made a breakthrough in polyamide blown film processing with Akulon XS. Due to its improved crystallization properties, Akulon XS has an extended processing window, providing new opportunities in designing co-extruded multi-layer as well as monolayer film structures.

DSM has announced plans to build a new plant for high viscosity Akulon polyamide 6 grades for film and other extrusion applications in North America.

In high performance engineering plastics for the electrical and electronics sectors, DSM will demonstrate use of Stanyl and Stanyl ForTii for high performance DDR4 memory connectors.

Michelle Brand, marketing director at DSM Engineering Plastics – Americas, will present on ‘Material Challenges and Solutions for DDR4 Connectors’ on March 25 during the SPI Business of Plastics Seminar.

The presentation will take place at 10:00 in the West Building Level 4, Room W414D and will address the development of various halogen free DDR4 sockets and the different options for the housing material.

DSM also recently unveiled the next generation of Diablo high temperature resistant grades in its Stanyl polyamide 46 and Akulon polyamide 6 portfolios.

These new Diablo grades are aimed at applications in automotive engine compartments such as air intake manifold, ducts and charge air cooler combinations, where temperatures can reach as high as 260°C.

Diablo technology, developed and patented by DSM improves the long term temperature resistance of materials and has been applied to various types of polyamide. (AR)

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